Enhancements To ANSYS® HFSS™ Promote Streamlined Electromagnetic Simulation
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In addition to the traditional 3D modeler interface, the new 3D electrical layout interface for ANSYS HFSS version 14.5 service pack 2 is a significant usability enhancement for designers of high-performance electronic devices. The update enables engineers to quickly and easily create sophisticated electromagnetic simulations using an intuitive layout interface and achieve reliable, accurate and high-fidelity results from the HFSS solver. The 3D electrical layout interface also enables more efficient integration with established EDA design flows as well as the direct import of layout geometry from ODB++ compatible databases such as Altium®, Cadence®, Mentor Graphics® and Zuken™.
The new planar MoM solver gives users the ability to quickly perform complex calculations and explore many design alternatives early in the design cycle while still being able to take advantage of HFSS' robust analysis capabilities to optimize and verify the design later in the process. Automatic set up of port assignment, radiation boundary conditions and layered material properties functionalities further simplify the model creation process and allows users to easily create designs of their electronic products with fully parametric planar stackups, via padstacks and transmissions lines, as well as other types of planar structures and transitions.
"HFSS is a very powerful and valuable tool in my signal integrity simulation tool suite," said
"The new 3D electrical layout interface for ANSYS HFSS allows users to easily create fully parametric designs of printed circuit boards, electronic packages and custom integrated circuits from an intuitive interface," said
ANSYS HFSS users can download the new version from the ANSYS customer portal.
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